Metrology for the intelligence community; direct-write silver deposition
The semiconductor industry continues to move full speed ahead with traditional chip scaling. There are several challenges in the arena. One of the big but lessor known challenges is metrology. Metrology, the science of characterizing and measuring films and structures, is becoming more complex, challenging and expensive at each node. Looking to solve some major problems in the metrology arena, the Intelligence Advanced Research Projects Activity (IARPA) recently announced an effort to develop metrology tools that could image current and future chips at a faster rate.