Program Manager

Kerry Long

Program Information

IARPA-BAA-16-12

Virtue logo final 150dpi web print 1The aims of the VirtUE program are (a) to creatively define and develop user environments that are more dynamic, secure, auditable, transferrable, and efficient than the current offerings provided by traditional physical workstations and commercial VDI; (b) develop innovative, dynamic analytics and infrastructures that can leverage these newly developed user environments to both automatically detect and deter security threats that IC user environments will be subject to in the new cloud infrastructure.

Related Program(s)

Research Area(s)

  • Theoretical 
  • Computer virtualization
  • Operating systems
  • Cyber security
  • Vulnerability analysis
  • Insider threat remediation and detection
  • Active defense
  • Big data analytics
  • Sensor fusion
  • User interfaces
  • Anomalous event detection

Related Article(s)

Program Manager

For information contact: dni-iarpa-info@iarpa.gov

Program Information

IARPA-BAA-11-09
IARPA Day Poster

The goal of the TIC Program is to develop and demonstrate split-manufacturing, a new approach to chip fabrication where security and intellectual property protection can be assured.

The semiconductor industry has been advancing rapidly with aggressive scaling. Extending beyond the Moore’s Law of digital processing and storage integrated circuits, this scaling has extended to 3-dimensions to keep pace. This scaling trend has fostered the integration of diverse analog and digital components to provide high value systems such as sensors, actuators, and biochips. The key capabilities to fabricate the high performance integrated circuit components for these high value systems are in the commercial foundries, which now dominate the world’s production of high performance integrated circuits. It is desirable for the US academic community and the US industrial base to have open and assured access to obtain the highest performance integrated circuits (IC’s) and systems-on-chips (SoC’s) while ensuring that components have been securely fabricated according to design and that intellectual property is protected.

Performers (Prime Contractors)

Carnegie Mellon University; Cornell University; LGS Innovations, LLC; Northrop Grumman Corporation; Raytheon Vision Systems; Stanford University; University of Southern California - Information Sciences Institute

Research Area(s)

  • Cybersecurity & information assurance
  • Hardware assurance
  • Microelectronics

Related Publications

To access TIC program-related publications, please visit Google Scholar.

Related Article(s)

Program Manager

Mark Heiligman

Program Information

IARPA-BAA-16-03

SuperTools seeks to develop a superconducting circuit design flow with a comprehensive set of Electronic Design Automation (EDA) and Technology Computer Aided Design (TCAD) tools for Very-Large-Scale Integration (VLSI) design of Superconducting Electronics (SCE).

Performers (Prime Contractors)

University of Southern California; Synopsys Inc.

Research Area(s)

  • Superconducting electronics
  • Advancements/alternatives to semiconductor-based exo-scale computing
  • cryogenic computing

Related Article(s)

Program Manager

Bill Harrod

Program Information

Broad Agency Announcement: W911NF-18-S-0009

The Intelligence Advanced Research Projects Activity (IARPA) seeks development of technology and techniques for energy-efficient, high data rate transmission of digital signals between computing systems operating at room and cryogenic temperatures. The focus in the SuperCables program is demonstration of components to convert from low level electrical signals in circuits operating at a temperature of approximately 4 kelvins to conventional optical signals at room temperature. Pending results of this program, IARPA may support a follow-on program to develop the complete system for data transmission between room temperature and 4 kelvins.

Related Program(s)

C3

SuperTools

Research Area(s)

  • Superconducting electronics
  • Photonics
  • Cryogenics
  • Optical communications

 

Program Manager

For more information, contact: dni-iarpa-info@iarpa.gov

Program Information

IARPA-BAA-10-10

SLiCE logo FINAL 72dpiSLiCE focuses on enhancing geolocation in complex environments primarily from long standoff receivers. The challenges addressed include low signal power, emitter motion, multipath propagation, and dense interference environments.

Related Program(s)

Research Area(s)

  • Communication systems
  • Geolocation
  • Electromagnetics
  • Radio frequency

Related Publications

To access SLiCE program-related publications, please visit Google Scholar.